Company Info

Production Line

Trust worthy products are manufactured on our exclusive automated, fully integrated equipment.

IC and Transistor Production Line

[ Assembly Process ]

Dicing Wafers are cut using a blade (diamond grindstone) to separate into pellets.
Wire bonding
Wire bonding The bonding pads of pelletized frames and leads are electrically bonded by gold wires.

[ Screening process ]

Testing After product leads are cut and formed, ICs are electrically tested and then subjected to a visual inspection system before being taped.