Touring Our Offices | HIGH COMPONENTS AOMORI CO.,LTD.

Production Line

Trust worthy products are manufactured on our exclusive automated, fully integrated equipment.

[ Assembly Process ]


	Wafers are cut using a blade (diamond grindstone) to separate into pellets.


	The bonding pads of pelletized frames and leads are electrically bonded by gold wires.

[ Screening process ]


	After product leads are cut and formed, ICs are electrically tested and then subjected to a visual inspection system before being taped.