About Our Service

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About Our Service

1. Package assemblies

We implement it and deliver it to an external form desired if we have you provide it with a semiconductor wafer. It processes it and copes with an individual process as well as coherent work from a die thing to a test, packing.

2. Wafer processing

Back grinding

We are able to back-grinding to the thickness of 100μm for wafer of 150-200mm in the diameter without the crack and the dividing.

Optimization of grinding condition
Condition putting out matched to process of wafer
Analysis tecnology of damage

Dicing

We are able to back-grinding to the thickness of 100μm for wafer of 100-200mm in the diameter without the crack and the peeling. It is possible to correspond.

Optimization of dicing blade
Optimization of dicing condition
Optimization of dicing tape

3. Test Service

We provide you with best test solutions by making full use of technological prowess and know-how specific to manufactures specializing in semiconductors and the latest-type testers.

Contents of Service

Test engineering support
Development and debugging of test programs.
Design and making of test boards and fixtures.
Information provision service
Test result summary information
Production control achievement information

4. Diverse package variations

Our packages, available in diverse variations, enable us to fulfill whatever requirements you may have for packages, from small IC packages to transistor super-compact packages. Among other things, we have an abundant supply of discrete system packages.

5. Environment responses

We have been working on a program to make the solder used in lead processing lead-free. (For a detailed schedule, contact.)

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