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QFN・SON Leadless Packages

* Cu Lead frame type

QFN・SON Leadless Packages
DFN(Dual Flat No Lead Package)
PKG Pin Count Lead
Pitch
(mm)
PKG Size(mm)
D E A(Max)
0.800 0.775 0.600 0.500 0.450 0.425 0.400 0.330 0.300
DFN1010 4 0.65 1.00 1.00     *   *        
6 0.35 1.00 1.00     *   SON1212 LeadPitch 0.50        
DFN1212 4 0.50 1.20 1.20 SON1212 LeadPitch 0.50                
6 0.40 1.20 1.20 * * * *   SON1212 LeadPitch 0.40    
DFN1216 8 0.40 1.60 1.20   * * * *      
DFN1515 6 0.50 1.50 1.50 *   SON1515 LeadPitch 0.50        
8 0.40 1.50 1.50 *   SON1515 LeadPitch 0.40        
DFN1616 6 0.50 1.60 1.60       * *  * 
8 0.40 1.60 1.60 SON1212 LeadPitch 0.40   *      
DFN2020 8 0.50 2.00 2.00              
DFN3030 8 0.65 3.00 3.00            
QFN1111 8 0.40 1.10 1.10     *          
QFN2020 12 0.40 2.00 2.00     *          
QFN2323 16 0.40 2.30 2.30   *   *      
QFN3030 12 0.50 3.00 3.00              
16 0.50 3.00 3.00 * *   *      
QFN4040 24 0.50 4.00 4.00              
QFN5050 32 0.50 5.00 5.00            
QFN6060 36 0.50 6.00 6.00              
QFN7070 48 0.50 7.00 7.00              
QFN8080 56 0.50 8.00 8.00              
64 0.40 8.00 8.00                
72 0.40 8.00 8.00              

: PKG which is attached of the drawing

* Electronic forming lead type

PKG

Pin

Count

Lead
Pitch
(mm)
PKG Size(mm)
D E A(Max)
0.600 0.400 0.330 0.300
DFN1010 4 0.65 1.00 1.00 * * * *
DFN1616 6 0.50 1.60 1.60 * * *
DFN1820 6 0.50 1.80 2.00 * * *
QFN155115 10 0.40/0.425 1.55 1.15 * * *

: PKG which is attached of the drawing

About PKG size except the above

Dicing package of QFN/SON is available for production only in preparation for lead frame.Preparation for external form sample making can be completed in one month, because die arrangement is unnecessary.

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