About Our Service
1. Package assemblies
We implement it and deliver it to an external form desired if we have you provide it with a semiconductor wafer. It processes it and copes with an individual process as well as coherent work from a die thing to a test, packing.
2. Wafer processing
We are able to back-grinding to the thickness of 100μm for wafer of 150-200mm in the diameter without the crack and the dividing.
We are able to back-grinding to the thickness of 100μm for wafer of 100-200mm in the diameter without the crack and the peeling. It is possible to correspond.
3. Test Service
We provide you with best test solutions by making full use of technological prowess and know-how specific to manufactures specializing in semiconductors and the latest-type testers.
Contents of Service
4. Diverse package variations
Our packages, available in diverse variations, enable us to fulfill whatever requirements you may have for packages, from small IC packages to transistor super-compact packages. Among other things, we have an abundant supply of discrete system packages.
5. Environment responses
We have been working on a program to make the solder used in lead processing lead-free. (For a detailed schedule, contact.)